Integrated Circuit Manufacturing CMOS Technology
The MOSFET (metal-oxide-semiconductor field-effect transistor) is the dominant device used in modern integrated circuits because it can be scaled to smaller dimensions than other types of devices. More ...
Integrated Circuit Manufacturing Impurity Doping
Impurity doping is the introduction of controlled amounts of impurities into semiconductors to change their electrical properties. Diffusion and ion implantation are the two key methods of impurity doping. More ...
Magnetism Permeability and Retentivity
Permeability is a property of a material that describes the ease with which magnetic flux is established in the material. Retentivity is a materials ability to retain a certain amount of residual magnetism after the magnetizing force is removed. More ...
Integrated Circuit Manufacturing E-Beam Lithography
Optical lithography high resolution, at low cost, but it has limitations. Electron-beam lithography uses an electron gun to generate a beam of electrons to produce submicrometer resist geometries without a mask. More ...
How to Read a Capacitor's Values
Due to the limited space available for printing, physically small capacitors are especially difficult to read. Therefore capacitors use a wide variety of codes to describe their characteristics. More ...
How to Calculate Impedance
Impedance is one of the most difficult things the electronics technician student needs to calculate. To calculate impedance, you must know the value of all resistors and the impedance of all inductors and capacitors in the circuit. Then you can calculate impedance using a simple mathematical formula. More ...
Integrated Circuits
An integrated circuit (IC) is a thin rectangular piece of semiconductor upon which, using a photographic process, thousands of electronic components, and the conducting paths to connect them, are printed. The types circuits that can be etched into a semiconductor chip range from amplifiers to logic gates and even microprocessors with millions of transistors. More ...
Transforming Sources for Circuit Analysis
Kirchhoff's laws and Ohm's laws can get pretty laborious when you're analyzing complex circuits. Through a transformation technique, you modify a complex circuit so that in the transformed circuit, the devices are all connected in series or in parallel. After the transformation, you no longer need to systematically apply Kirchhoff's laws. More ...
Transformers
Transformers work according to the principle of electromagnetic induction. If the first coil carries sine-wave ac of a certain frequency, then the induced current will be sine-wave ac of the same frequency in the second coil. More ...
Zener Diode
A zener diode is similar to a standard diode allowing current flow in the forward direction except the semiconductor is more heavily doped and this allows it to operate in the reverse-bias break down mode. More ...
Batteries
Early in the history of electrical science, laboratory physicists found that when metals came into contact with certain chemical solutions, voltages appeared between the pieces of metal. These were the first electrochemical cells. More ...
Circuit Analysis with Thevenin's theorem
Thevenins theorem states that Any linear electronic network containing only voltage sources, current sources and resistances can be replaced by an equivalent combination of a voltage source in a series connection with a resistance. More ...
Use a Resistor to Measure Inductance
Inductance is usually measured by using an LCM multimeter. It can also be mesured using a resistor. With the resistor method, you adjust the frequency of a sine wave until the AC voltage accross the resistor and inductor are equal. Then using a formula to calculate the inductance. More ...
Integrated Circuit Fabrication Photolithography
Photolithography is the process of transferring patterns on a mask to a thin layer ofphotoresist covering the surface of a semiconductor wafer. These patterns define the various regions in an integrated circuit, such as the implantation regions, the contact windows, and the bonding pad areas. More ...
