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Electronics

Phase shift in AC Circuits
In an AC circuit with a capacitor or an inductor there is a phase shift between voltage and current. In this article you learn how to calculate the amount of that phase shift. More ...

Magnetism
Electric currents and magnetic fields are closely related. Whenever an electric current flows a magnetic field accompanies the current. When a wire is coiled up, the resulting magnetic flux becomes more concentrated. More ...

Common Emitter Configuration Transistor Biasing
To design a common emitter amplifier circuit, use a voltage divider with resistors selected to set the base voltage at the center of the transistor's linear region. Then, through a DC blocking capacitor, apply a waveform to the transistor's base. More ...

Integrated Circuit Manufacturing BiCMOS Technology
BiCMOS is a technology that combines both CMOS and bipolar device structures in a single IC. The reason to combine these two different technologies is to create an IC chip that has the advantages of both CMOS and bipolar devices. More ...

Magnetism Permeability and Retentivity
Permeability is a property of a material that describes the ease with which magnetic flux is established in the material. Retentivity is a materials ability to retain a certain amount of residual magnetism after the magnetizing force is removed. More ...

Integrated Circuits
An integrated circuit (IC) is a thin rectangular piece of semiconductor upon which, using a photographic process, thousands of electronic components, and the conducting paths to connect them, are printed. The types circuits that can be etched into a semiconductor chip range from amplifiers to logic gates and even microprocessors with millions of transistors. More ...

Integrated Circuit Manufacturing Packaging
Before ICs can be put to their intended use they must be packaged. The package is responsible for interconnecting, powering, cooling, and protecting the IC. More ...

Integrated Circuit Manufacturing CMOS Fabrication Sequence
Complementary Metal Oxide Semiconductor (CMOS) is used to fabricate digital circuits and IC chips. It is a combination of NMOS (N-type Metal Oxide Semiconductor) and PMOS (P-type Metal Oxide Semiconductor) transistor pairs. CMOS fabrication can be carried out in many ways. P-well is one of the processes in which CMOS fabrication is realized. More ...

Planar Integrated Circuit Fabrication
The key unit process steps in IC fabrication, include oxidation, photolithography, etching, ion implantation, and metallization. Here, we describe the oxidation steps. More ...

Electrical Charge
The forces between electrically charged particles are used in technologies such as printers, pollution filters, and spray guns used for painting cars and trucks. Static electricity is the study of phenomena that involve an imbalance of electrical charge. Although creating this imbalance typically requires moving charge around, once the imbalance is created, it often remains static for a long time. More ...

Integrated Circuit Manufacturing Deposition
Many different types of thin films are used to manufacture integrated circuits, including thermal oxides, dielectric layers, epitaxial layers, polycrystalline silicon, and metal films. This article addresses two techniques for depositing such films. More ...

Integrated Circuit Photoresist Process
The semiconductor photolithography process involves coating the substrate with A light-sensitive chemical layer called photoresist. Light is projected through a mask onto the substrate causings photoresists to react chemically. More ...

Electromagnetic Devices
Electromagnetic devices work based on the relationship between electrical current and a magnetic field. They are used to control valves, cooling and heating systems, relays, and electric motors. More ...

Integrated Circuit Fabrication Photolithography
Photolithography is the process of transferring patterns on a mask to a thin layer ofphotoresist covering the surface of a semiconductor wafer. These patterns define the various regions in an integrated circuit, such as the implantation regions, the contact windows, and the bonding pad areas. More ...

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