Inductor Mutual Inductance and Coefficient of Coupling
Mutual Inductance the property of a coil in which it opposes the change of current in another coil. The coefficient of coupling between two coils is the fraction of magnetic flux produced by the current in one coil that links with the other coil. More ...
The Diode
A diode is a semiconductor component designed to allow current to pass in one direction. To form a diode, a P type semiconductor is joined with an N type of the same semiconductor element, forming a P-N junction. Diodes are used for turning AC to DC, isolating signals, and mixing signals. More ...
Magnetism
Electric currents and magnetic fields are closely related. Whenever an electric current flows a magnetic field accompanies the current. When a wire is coiled up, the resulting magnetic flux becomes more concentrated. More ...
How to Calculate Impedance
Impedance is one of the most difficult things the electronics technician student needs to calculate. To calculate impedance, you must know the value of all resistors and the impedance of all inductors and capacitors in the circuit. Then you can calculate impedance using a simple mathematical formula. More ...
Light Emitting Diode (LED)
An LED is a diode that converts electrical current directly into light and therefore it is more efficient than other sources of light which convert some energy into heat. When electrons recombine with holes in the depletion region they release energy in the form of light photons. More ...
Planar Integrated Circuit Fabrication
The key unit process steps in IC fabrication, include oxidation, photolithography, etching, ion implantation, and metallization. Here, we describe the oxidation steps. More ...
Semiconductor Manufacturing Process Sequence
Semiconductor manufacturing consists of a series of sequential process steps in which layers of materials are deposited on substrates, doped with impurities, and patterned using photolithography to produce ICs. More ...
Integrated Circuit Manufacturing Etching
photolithography is the process of transferring patterns to photoresist covering the surface of a semiconductor wafer. To produce circuit features, these resist patterns must be transferred into the underlying layers of the device. Pattern transfer is accomplished by an etching process that selectively removes unmasked portions of a layer. More ...
Conductors and Insulators
Materials can be classified depending on whether they allow charge to move. If charge can easily move through a material, these materials are called conductors. If charge cannot move through a material, then this material is called an insulator. More ...
Triac
You can of a triac as two back-to-back SCRs with the cathode of one SCR connected to the anode of the other. The gates are connected together. Because we have a two SCRs configuration you can control the switching of both half cycles. More ...
EMI, RFI, EMC, EMS, What's the Difference?
EMI, RFI, EMC, and EMS all refer to different aspects of radio frequency interference which may cause elecronic devices to malfunction. Correcting these problems can be an art and a science. More ...
Integrated Circuit Fabrication Masks
A mask in IC Fabrication is a master template for an IC design. A light-sensitive material, is applied on the wafer. The mask as well as a wafer are inserted in a lithography scanner. More ...
Integrated Circuit Manufacturing Deposition
Many different types of thin films are used to manufacture integrated circuits, including thermal oxides, dielectric layers, epitaxial layers, polycrystalline silicon, and metal films. This article addresses two techniques for depositing such films. More ...
Integrated Circuit Photoresist Process
The semiconductor photolithography process involves coating the substrate with A light-sensitive chemical layer called photoresist. Light is projected through a mask onto the substrate causings photoresists to react chemically. More ...
